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Item
Production Capacity
Layer counts 2-30
Material FR-4、High-frequency、Cu-base、Al-base
Maximum Size 500mm X1000mm
Board Outline Tolerance ±0.12mm
Board Thickness 0.20mm--6.00mm
Thickness Tolerance ( t≥0.8mm) ±8%
Insulation Layer Thickness 0.075mm--5.00mm
Min Line 0.075mm
Min Space 0.07mm
Outer Copper Thickness 35um--420um
Inner Copper Thickness 17um--210um
Drill Hole (Mechanical) 0.15mm--6.35mm
Finish Hole (Mechanical) 0.10mm--6.30mm
Diameter Tolerance (Mechanical) 0.075mm
Registration (Mechanical) 0.05mm
Aspect Ratio 13:01:00
Solder Mask Type LPI
Min Soldermask Bridge 0.08mm
Min Soldermask Clearance 0.07mm
Plug Hole Diameter 0.25mm--0.60mm
Impedance Control Tolerance ±10%
Surface Finish HASL,LF-HASL,ENIG,Imm Tin,Imm Ag,OSP ,Gold Finger
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